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Sierra Wireless AirPrime EM7455 module supports the latest 4G and 3G networks in North America, Europe, and Asia. The PCI Express M.2 form factor allows easy integration into smaller and thinner devices.The EM7455 offers high-speed LTE Advanced connectivity with the latest technologies and multi-operator support. Optimized for low power consumption, enabling longer battery life, the AirPrime EM7455 is ideal for today’s mobile computing, networking, and industrial IoT applications.

AMD Ryzen Threadripper PRO 5995WX processor 2.7 GHz 256 MB L3

AMD Ryzen Threadripper PRO 5975WX processor 3.6 GHz 128 MB L3

AMD Ryzen Threadripper PRO 5965WX processor 3.8 GHz 128 MB L3

AMD Ryzen Threadripper PRO 5965WX processor 3.8 GHz 128 MB L3 Box

Corsair Vengeance RGB CMG16GX4M1D3600C18 memory module 16 GB 1 x 16 GB DDR4 3600 MHz

Axiom AX54800S40D/32G memory module 32 GB 1 x 32 GB DDR5 4800 MHz

Corsair Vengeance RGB RS CMG8GX4M1D3600C18 memory module 8 GB 1 x 8 GB DDR4 3600 MHz

Axiom AX54800N40D/32G memory module 32 GB 1 x 32 GB DDR5 4800 MHz

Thrilling Performance and Quality Guaranteed AORUS DDR5 memory deliver reliably fast DDR5-5200 memory speed, also bring the new experience of the latest XMP 3.0. Moreover, by utilizing Copper-aluminum composite with NanoCarbon heat spreader, there is no compromise when overclocking. Offering higher performance, better bandwidth, and lower power consumption than DDR4 modules. AORUS DDR5 memory is a new evolution for all PC enthusiasts and extreme gamers. Optimized Working Voltage, Better Energy Saving AORUS DDR5 memory deliver ultra-fast speed. However, when running at similar frequency, AORUS DDR5 memory operate with lower power consumption as compared to DDR4. COPPER-ALUMINUM COMPOSITE WITH NANOCARBON HEAT SPREADER AORUS DDR5 memory adopts a new copper-aluminum composite material heat spreader. Combine the advantages of copper’s heat conduction and aluminum's heat dissipation, make sure no compromise when overclocking. Besides, with NanoCarbon coating, enhance passive thermal spreader when under ultra-high performance. The coating material covers the entire heat spreaders. In that way, heat is dissipated more quickly. High voltage may cause a memory peak over 70°C and failure. However, Copper-aluminum composite with NanoCarbon heat spreader, a dedicated design for DDR5, greatly helps to avoid any potential problem when overclocking; moreover, keep the temperature under 70°C. SUPPORTS NEW XMP 3.0, DEFINE YOUR OWN XMP PROFILE AORUS DDR5 memory module supports the latest XMP 3.0 specification, improves overclocking capabilities and profiles. Not only apply the pre-tune XMP profile, now, users can define and fine-tune their own XMP profiles, and save profiles into SPD ROM. Enjoy benefits from XPM 3.0 by AORUS DDR5 memory module.